科技與工程學院

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沿革

科技與工程學院（原名為科技學院）於87學年度成立，其目標除致力於科技與工程教育師資培育外，亦積極培育與科技產業有關之工程及管理專業人才。學院成立之初在原有之工業教育學系、工業科技教育學系、圖文傳播學系等三系下，自91學年度增設「機電科技研究所」，該所於93學年度起設立學士班並更名為「機電科技學系」。本學院於93學年度亦增設「應用電子科技研究所」，並於96學年度合併工教系電機電子組成立「應用電子科技學系」。此外，「工業科技教育學系」於98學年度更名為「科技應用與人力資源發展學系」朝向培育科技產業之人力資源專才。之後，本院為配合本校轉型之規劃，增加學生於科技與工程產業職場的競爭，本院之「機電科技學系」與「應用電子科技學系」逐漸朝工程技術發展，兩系並於103學年度起分別更名為「機電工程學系」及「電機工程學系」。同年，本學院名稱亦由原「科技學院」更名為「科技與工程學院」。至此，本院發展之重點涵蓋教育（技職教育/科技教育/工程教育）、科技及工程等三大領域，並定位為以技術為本位之應用型學院。

107學年度，為配合本校轉型規劃，「光電科技研究所」由原隸屬於理學院改為隸屬本（科技與工程）學院，另增設2學程，分別為「車輛與能源工程學士學位學程」及「光電工程學士學位學程」。

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學院網址：http://www.cot.ntnu.edu.tw/

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Author: search.filters.author.Yang, Chii-RongSubject: search.filters.subject.Anionic surfactant

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    Effects of mechanical agitation and surfactant additive on silicon anisotropic etching in alkaline KOH solution
    (Elsevier, 2005-03-28) Yang, Chii-Rong; Chen, Po-Ying; Chiou, Yuang-Cherng; Lee, Rong-Tsong
    Agitation is a key method that significantly affects silicon wet anisotropic etching quality including the etching rate and surface roughness. This study introduced the ultrasonic agitation to improve the roughness quality of etched (1 0 0) silicon plane in 30 wt.% KOH solution. These etching characteristics have been compared with those using magnetic stirring and no agitation. In ultrasonic agitation condition, the etching rate increases linearly with agitating power, but the surface roughness worsens. Although the etching rate always exceeds 1.2 μm/min and the average roughness, Ra is below 15 nm, the membrane microstructures are damaged easily by ultrasonic agitation. Moreover, the KOH solution with added anionic surfactant, dihexyl ester of sodium sulfosuccinic acid, is also used to evaluate the etching properties of (1 0 0) silicon under without agitation. Owing to increasing hydrophilic ability between the hydrogen bubble and silicon surface and the effect of silicon wettability, the etching properties are promoted drastically. Experimental results show that the average roughness, Ra can be reduced to 7.5 nm in aqueous KOH with anionic surfactant, which is about eight times better than achieved by the pure KOH solution without agitation for etching temperature of 100 °C. Meanwhile, the etching rate can be enhanced to 4.9 μm/min, which is 1.44 times better than that is obtainable in a pure KOH solution with ultrasonic agitation. The etching rate of the KOH solution with added surfactant is about twice that in the KOH solution with isopropyl alcohol (IPA) for etching temperature of 80 °C. Furthermore, this study also illustrates the reflectivity of etched surface for visible wavelength and the fabrication of thin film microstructures.